This checklist is designed for teams using a digital microscope to verify board quality quickly and consistently. It is most useful for incoming inspection, in-process quality control, and rework confirmation.
For the recommended Smart G-Scope setup, review the PCB inspection use case and the industrial quality control page.
1. Prepare the station
Before inspecting the board, confirm:
- The board is stable on the work surface
- The lens is clean
- Lighting is adjusted to reduce glare on solder joints
- Magnification is high enough for the defect type but not so high that orientation becomes difficult
- The operator can capture images without moving the board unnecessarily
2. Check solder joints
Inspect representative joints and any suspect areas for:
- Solder bridges between adjacent pads or leads
- Insufficient wetting
- Dull or irregular joint surfaces
- Cracks or ring fractures
- Excess solder or solder balls
- Cold joints after rework
Capture comparison images when the defect is subtle or when the board may need escalation.

3. Check pads, traces, and component placement
Verify:
- Pads are intact and not lifted
- Fine traces are not scratched or contaminated
- Components are aligned as expected
- Polarity-sensitive parts are placed correctly
- Residue or foreign particles are not obscuring critical areas
This is where a repeatable microscope stand helps. If the team needs that kind of setup, compare the options on the accessories page.
4. Review rework areas separately
Any reworked section should be checked more strictly than the rest of the board. Confirm:
- Old solder has been cleaned properly
- Pads are still mechanically sound
- Heat exposure has not damaged nearby parts
- The new joint shape is consistent with acceptable workmanship
- Flux residue is not hiding the final condition
5. Document recurring defects
When the same issue appears across several boards or operators, capture a short series of images instead of a single isolated photo. That makes it easier to:
- Compare batches
- Train operators
- Report the issue to production or suppliers
- Track whether process changes actually improve results
The software workflow matters here because a microscope only adds value if the team can review and share what it sees.

6. Escalate when visual inspection is not enough
Escalate the board when:
- The defect appears to extend under hidden packages
- Internal damage is suspected
- The root cause cannot be confirmed from visible surfaces
- A failure analysis process needs more than visual evidence
Quick summary
If you want a simple working rule, remember this: use the microscope to stabilize visual judgment, not to replace process discipline. Good inspection comes from repeatable setup, clear lighting, and consistent documentation.
If you want help defining the right Smart G-Scope configuration for PCB work, use the contact page and describe your board type, component size, and whether the workflow is QC, rework, or service diagnosis.